Professional Publications

Additional publications can be found on Google Scholar.Ìý

2024

  1. A. Rao, E. Bogatin, M. Piket-May, and M. F. Hadi, "Non-TEM Dispersion in Microstrip Structures at High Data Rates," IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 178–185, 2024, doi: .

2021

  1. T. W. Lee, F. de Paulis, M. Resso, M. Piket-May and E. Bogatin, "Non-destructive PCB Substrate Height Extraction with Multi-Measurement Technique," 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), Siegen, Germany, 2021, pp. 1-4, doi: .

2019

  1. E. Bogatin, S. Sandler, L. Smith, "Power Distribution Network (PDN) Impedance and Target Impedance," [Online]. Available: .
  2. E. Bogatin, "Experiments and Demonstrations at EMC+SIPI 2019," [Online]. Available: .

2018

  1. F. Deek, M. Piket-May and E. Bogatin, "Transfer Impedance Drop off in Power/Ground Plane Cavities," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 105-109, doi: .
  2. L. Smith and E. Bogatin, "Principles of Power Integrity for PDN Design:," 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), Long Beach, CA, USA, 2018, pp. 1-74, doi: .

2017

  1. H. Barnes, E. Bogatin and J. Moreira, "Development of a PCB kit for s-parameter de-embedding algorithms verification," 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Washington, DC, USA, 2017, pp. 510-515, doi: .
  2. E. Bogatin and K. Radhakrishna, "Synthesis of high speed channels from shorter elements," in IEEE Electromagnetic Compatibility Magazine, vol. 6, no. 1, pp. 85-90, First Quarter 2017, doi: .

2013

  1. E. Bogatin, D. DeGroot, P. Huray, Y. Shlepnev, "Which One is Better? Comparing Options to Describe Frequency Dependent Losses" (2013). Faculty Publications. 1665.
  2. E. Bogatin, L. Simonovich, "Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias," [Online]. (2013). Design Con 2013. .